Beelink SER10 MAX (AI9 HX 470, 64GB+1TB SSD)

Beelink SER10 MAX (AI9 HX 470, 64GB+1TB SSD)

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簡介

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【Powerful AMD Ryzen™ AI 9 HX 470 CPU and AMD Radeon™ 890M GPU】 【10Gbps Wired Networking – 4x Faster than 2.5G】 【Storage Expansion Options】 【MSC 2.0 Vapor Chamber Uniform Cooling Technology】 【Triple-display Output】

商品詳情

BEELINK SER10 MAX mini PC

Beelink SER10 MAX is a high-performance mini PC powered by the AMD Ryzen AI 9 HX 470 processor. It is designed for demanding AI workloads, creative content creation, and gaming, featuring the AMD Radeon 890M integrated graphics and a dedicated NPU for up to 86 TOPS of AI.

Powerful AMD Ryzen™ AI 9 HX 470 CPU and AMD Radeon™ 890M GPU

AMD Ryzen™ AI 9 HX 470 CPU (12 cores, Zen 5 Architecture), combined with a new Radeon™ 890M iGPU, a new generation XDNA 2 NPU and 86 AI TOPS, the Ryzen™ AI 9 HX470 processor’s fully upgraded architecture significantly boosts the SER10 MAX's overall performance, delivering a faster, smarter, and more secure Al PC experience!

Storage Expansion Options

SER10 MAX features high frequency DDR5 5600 MT/s RAM of 32GB/64GB, delivering you the smoothest experience in Al computing, gaming and multimedia entertainment. There are also dual high-speed M.2 2880 PCle 4.0 SSD slots, supporting up to 8TB (Maximum 4TB per module) of fast internal storage.

Triple-display Output

With HDMI (2.1) & DisplayPort & Full Featured USB 4.0 (40Gbps/PD/DP1.4), the SER10 MAX supports up to triple 4K displays

10Gbps Wired Networking 

The SER10 MAX features an upgraded 10Gbps LAN port, delivering four times the speed of standard 2.5Gbps Ethernet. This enables ultra-fast transfers of large files, swift backups, and low-latency connections-eliminating bottlenecks and delivering a seamless high-speed networking experience.

MSC 2.0 Vapor Chamber Uniform Cooling Technology

The MSC 2.0 Vapor Chamber evenly and rapidly distributes CPU heat across the entire cooling surface, preventing localized hotspots and significantly improving thermal efficiency. By spreading heat instantly to every contact point, it enables faster heat dissipation, more stable performance under heavy workloads, and sustained peak output even during long-term, high-intensity operation.

Specifications :

ModelSER 10 Max
ProcessorAMD Ryzen™ AI 9 HX 470, 12 cores / 24 threads, turbo up to 5.2GHz, 24 MB L3 Cache
AI performance : Up to 86 TOPS (overall)
GraphicsAMD Radeon™ 890M (up to 3.1GHz)
MemoryDual channel DDR5 SODIMM x 2 (max 64GB)
Pre-installed : 32 / 64GB DDR5 (5600MHz)
Storage2 x M.2 2280 PCle4.0 x4 Slots (max.8TB)
Pre-installed : 1TB SSD
Ethernet1 x 10Gb LAN port (10/100/1000/2500/10000 Mbps)
Wireless- WiFi 6 (Intel AX200)
- Bluetooth 5.2
Video OutputHDMI (2.1) x 1 (4K@240Hz)
DisplayPort (1.4) x 1
USB 4.0 Type-C x 1 (40 Gbps/PD/DP1.4)
Support triple 4K displays
AudioHDMI (2.1) x 1
3.5mm Audio Jack x 2
I/O Ports & ButtonHDMI (2.1) x 1
DisplayPort (1.4) x 1
USB 4.0 Type-C x 1 (40 Gbps)
USB 3.2 Type-C x 1 (10 Gbps, Data)
USB 3.2 Gen 2 Type-A x 2 (10 Gbps)
USB 2.0 x 2
10 Gb LAN Port x 1
3.5mm Audio Jack x 2
Power Button x 1
Reset Hole x 1
Cooling SystemMSC 2.0 Cooling System :
Vapor Chamber + Silent Fan + SSD Heatsink
PowerDC 19V, 5.26A Adapter (100W)
Operating SystemWindows 11 Pro
Case MaterialAluminium
Dimensions (W x D x H)135 x 135 x 44.7 mm
Weight520 g

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